| 摘要 |
A multi-layer structure ( 102 ) includes a first build-up layer structure ( 202 ) configured to connect to a heat-generating module ( 120 ), a second build-up layer structure ( 206 ) configured to connect to a substrate, and a middle layer ( 204 ) provided between the first build-up layer structure and the second build-up layer structure, the middle layer including at least one semiconductor component ( 110 ) and a heat spreader ( 130 ). A first set of thermal vias ( 210 ) extend through the first build-up layer structure to the heat spreader, and a second set of thermal vias ( 2100 extend through the second build-up layer structure to the heat spreader, wherein at least a portion of the first set of thermal vias is in thermal contact with the heat-generating module.
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