发明名称 MODULAR DESIGN METHOD AND APPARATUS
摘要 Disclosed is a procedure or design approach for functional modules that may be used in connection with a multiprocessor integrated circuit chip. The approach includes keeping the dimensions of each module substantially the same and having the bus, power, clock and I/O connection configured the same on all modules. Further requirements for ease of use are to generalize the capability of each module as much as possible and to decentralize functions such as testing to be primarily performed within each module. The use of such considerations or rules substantially eases the design of a given type of custom chips, and based upon an initial chip design greatly facilitates the design of further custom chips, similar in application, but subsequent to the successful completion of the initial chip. The standardization modules and replication of the modules on a given chip also reduces physical verification time in initial chip design as well as redesign time of the initial chip when requirements for chip capability are redefined or otherwise changed. Any subsequent or further custom chips can include more or less of specific modules based upon already established parameters.
申请公布号 US2008235647(A1) 申请公布日期 2008.09.25
申请号 US20080130268 申请日期 2008.05.30
申请人 HOFSTEE HARM PETER;KAHLE JAMES ALLAN;YAMAZAKI TAKESHI 发明人 HOFSTEE HARM PETER;KAHLE JAMES ALLAN;YAMAZAKI TAKESHI
分类号 G06F17/50 主分类号 G06F17/50
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