摘要 |
PROBLEM TO BE SOLVED: To provide a wafer-conveying robot of which the wafer feeding capability is high. SOLUTION: A wafer-conveying robot 1 includes: a movable main body 5; a robot arm 7 which is provided in the main body 5 and comprises a hand 19 capable of holding a wafer 20 on its end; and an aligner 6 which is provided in the main body 5 and comprises an adsorption pad 14 capable of holding the wafer 20, wherein the aligner 6 is capable of moving the adsorption pad 14 vertically and horizontally to the main body 5 and rotating it around a horizontal axis and is capable of delivering the wafer 20 with the hand 19 by vertically moving the adsorption pad 14. COPYRIGHT: (C)2009,JPO&INPIT
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