| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit substrate that can be formed easily and is capable of suppressing the occurrence of torsion while maintaining elastic modulus and applying a scaling technique as is in the current substrate manufacture. SOLUTION: An intermediate layer 12 in which a plurality of prepregs 11 are laminated, in which resin 11b is impregnated in fibers 11a, is sandwiched by prepregs 14 in which resin 14b is impregnated in fibers 14a oriented in the direction of torsion of the intermediate layer 12, and thus a stress that occurs between the prepregs 14 formed at the uppermost part and the lowermost part of the intermediate layer 12 and the intermediate layer 12 is offset. Because of this, it is possible to apply the scaling technique as is in the current substrate manufacture and to considerably suppress the deformation resulting from the torsion generated in a circuit substrate 10. COPYRIGHT: (C)2009,JPO&INPIT
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