| 摘要 |
A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane represented by the following general formula: X-R2-(R12SiO)mR12Si-R2-X {where R1 designates a monovalent hydrocarbon group that has six or fewer carbon atoms and is free of aliphatic unsaturated bonds; R2 designates an alkylene group; and X is an organopolysiloxane residue represented by the following average unit formula: (YR12SiO1/2)a(SiO4/2)b (where R1 is the same as defined above; Y is a single bond, a hydrogen atom, a group represented by aforementioned R1, an epoxy-containing alkyl group, an alkoxysilylalkyl group, or an alkyl group with seven or more carbon atoms; however, in one molecule, at least one Y is a single bond, and at least one Y is an alkyl group with seven or more carbon atoms; "a" is a positive number; "b" is a positive number; and "a/b" is a number in the range of 0.2 to 4.0), the aforementioned group represented by R1 or an alkenyl group; however, at least one X is the aforementioned organopolysiloxane residue; and "m" is an integer equal to or greater than 1} and (B) a curing agent for epoxy resin; possesses good handleability and, when cured, forms a cured silicone body having low modulus of elasticity. |
