ADHESIVE COMPOSITION FOR THERMALLY CONDUCTIVE SHEET AND THERMALLY CONDUCTIVE SHEET THEREFROM

摘要

The present invention relates to an adhesive composition for a thermally conductive sheet and a thermally conductive sheet manufactured therefrom and, more particularly to an adhesive composition for a thermally conductive sheet capable of minimizing delamination of a substrate surface due to a cure-shrinkage which can possibly occur during a thermal curing process of the thermally conductive sheet using conventional thermally conductive materials or single-molecule epoxy, by using phenoxy resins as a main ingredient for the thermally conductive sheet; and a thermally conductive sheet manufacture therefrom. The adhesive composition for a thermally conductive sheet according to the present invention contains: phenoxy resins; a thermal curing agent; and a mixture of two different types of thermally conductive fillers, wherein an adhesive layer forms a cross-linkage by the thermal curing.