| 摘要 |
The present invention relates to a conditioner for a chemical mechanical polishing apparatus, which comprises: an arm extending from the center of rotation to perform reciprocating rotation; a rotary shaft disposed on the end of the arm to rotate; and a conditioning disk rotating by interlocking with the rotary shaft, having a bottom which forms a contact surface in contact with a polishing pad, and having a nozzle formed on the contact surface to spray pure water. The conditioner of the present invention removes abrasive grains and slurry particles, which are separated from a wafer during a chemical mechanical polishing process and caught in micropores of the polishing pad, by the pure water sprayed through the nozzle, thereby enabling slurry to be smoothly introduced into the wafer through the micropores of the polishing pad even though the amount of the slurry supplied to the polishing pad through the micropores of the polishing pad is small. |
