| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning wafer or substrate for use in cleaning, or in combination with, an integrated chip manufacturing apparatus.SOLUTION: A cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, or projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as in an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can be adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use in combination with the chip manufacturing apparatus. |
