MEMS COMPONENT HAVING A HIGH INTEGRATION DENSITY

摘要

The invention relates to a MEMS component having an increased integration density, and to a method for producing such a component. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between said base wafer and cover wafer. A second cavity is arranged over said cover wafer and beneath a thin-film cover. Said cavities contain component structures.