| 发明名称 |
EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEALED BY USING SAME |
| 摘要 |
An epoxy resin composition for sealing a semiconductor device, of the present invention, contains an inorganic filler, and the inorganic filler contains a nanomaterial containing silicon (Si) and aluminium (Al). |
| 申请公布号 |
WO2016175385(A1) |
申请公布日期 |
2016.11.03 |
| 申请号 |
WO2015KR07392 |
申请日期 |
2015.07.16 |
| 申请人 |
SAMSUNG SDI CO., LTD. |
发明人 |
BAE, Kyoung Chul;LEE, Dong Hwan |
| 分类号 |
C08K3/00;C08K3/22;C08L63/00 |
主分类号 |
C08K3/00 |
| 代理机构 |
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