| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a capsule type endoscope for which a solid-state image pickup element can be mounted on a small-sized substrate in high density together with other chip components without obstructing the image quality of the solid-state image pickup element. <P>SOLUTION: The manufacturing method includes a process of mounting the chip component 34 to an image pickup substrate 30 stored inside a tightly sealing container to be introduced into a celom and a process of mounting the solid-state image pickup element 31 to the image pickup substrate 30 on which the chip component 34 is mounted. As a result, the solid-state image pickup element 31 is mounted on the image pickup substrate 30 together with the other chip component 34 in the high density without obstructing the image quality of the solid-state image pickup element 31. Further, since the solid-state image pickup element 31 is mounted after the chip component 34 is mounted, dust caused by mounting the chip component 34 is prevented from sticking to the solid-state image pickup element 31. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
