| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain an imaging apparatus making it unnecessary to provide a space for wiring a lead wire and FPC, and also a space margin due to an error of a soldering amount, and making a production process simplify. <P>SOLUTION: The imaging apparatus includes an optical system having light from an object incident thereon, a drive portion for driving the above optical system according to an input electric current, a case portion housing the optical system and the drive portion, and having a connection terminal portion for supplying the current to the drive portion, a photodetector element for receiving the light from the object via the above optical system, and a substrate having the above photodetector element mounted on the surface, having the above case portion adhered on the surface, and having a spring mounted on the surface so as to maintain contact with the connection terminal portion of the case portion by resilience. <P>COPYRIGHT: (C)2007,JPO&INPIT |
