METHOD FOR FORMING PAD REDISTRIBUTION LAYER

摘要

A method for forming a pad redistribution layer is provided to form a pad redistribution layer having a single layer structure by connecting metal patterns each other by using a bonding wire. A preparing process is performed to prepare a semiconductor chip(40) including a plurality of bonding pads. An insulating layer pattern(42) having an opening for exposing the bonding pads is formed on the semiconductor chip. A seed metal layer(43) is formed on the insulating layer pattern including the opening. A photoresist layer pattern is formed to expose a metal pattern region on the seed metal layer. A first metal pattern(45a) connected with the bonding pads is formed by depositing a metal layer on an exposed part of the seed metal layer. A second metal pattern(45b) used as a pad part is formed at the outside of the first metal pattern. A third metal pattern(45c) having a pad part is connected to the remaining bonding pad between the first and the second metal patterns. The photoresist pattern and the seed metal layer are removed. A bonding wire(46) is formed to connect electrically the first and the second metal patterns to each other.