CLUSTER TYPE SEMICONDUCTOR MANUFACTURING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE BY USE THEREOF

摘要

PROBLEM TO BE SOLVED: To prevent the decrease in the number of wafers which can be processed by a cluster type semiconductor manufacturing device per unit time.SOLUTION: A cluster type semiconductor manufacturing device comprises: a polyhedral transfer module 110 operable to transport a wafer; a first process module 120 operable to perform a gas removal step for removing fume on a surface of the wafer in a first face of the transfer module; a second process module 121 operable to perform a plasma cleaning step for cleaning the wafer surface in a second face; a standby module 130 operable to keep the wafer subjected to the gas removal step and the plasma cleaning step in a standby state for a fixe length of time in a third face; and a third process module 122 operable to perform an appropriate processing step on the wafer having gone through the standby state in the standby module in a fourth face.