| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an extremely thin and reliable semiconductor element package reduced in cost and simplified in process having a multichip. <P>SOLUTION: A first die 104 having a first bonding pad 108 is arranged in a die storage through hole 105. A first adhesive material 106 is formed under the die 104 and a second adhesive material 107 is filled into a gap between the die 104 and the sidewall of a substrate 102. A first bonding wire 112 is connected to the first bonding pad 108 and a first conductor pad 113. A second die 122 having a second bonding pad 126 is arranged in the first die 104. A second bonding wire 128 is connected to the second bonding pad 126 and the first conductor pad 113. A dielectric layer 118 is formed on the first and second bonding wires 112, 128, first and second dies 104, 122, and the substrate 102. <P>COPYRIGHT: (C)2008,JPO&INPIT |
