发明名称 VIA CONFIGURABLE ARCHITECTURE FOR CUSTOMIZATION OF ANALOG CIRCUITRY IN A SEMICONDUCTOR DEVICE
摘要 A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections of the plurality of circuit elements. The semiconductor device may include an interconnection quilt having a plurality of metal layers disposed to interconnect the plurality of circuit elements. The plurality of circuit elements may be analog circuit element and/or digital circuit elements. The tiles may be analog tiles and digital tiles that form a mixed signal structured array.
申请公布号 US2009061567(A1) 申请公布日期 2009.03.05
申请号 US20080268919 申请日期 2008.11.11
申请人 TRIAD SEMICONDUCTOR, INC.;VIASIC, INC. 发明人 KEMERLING JAMES C.;IHME DAVID;COX WILLIAM D.
分类号 H01L21/82;H01L27/118;H03K19/177 主分类号 H01L21/82
代理机构 代理人
主权项
地址