发明名称 |
VIA CONFIGURABLE ARCHITECTURE FOR CUSTOMIZATION OF ANALOG CIRCUITRY IN A SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections of the plurality of circuit elements. The semiconductor device may include an interconnection quilt having a plurality of metal layers disposed to interconnect the plurality of circuit elements. The plurality of circuit elements may be analog circuit element and/or digital circuit elements. The tiles may be analog tiles and digital tiles that form a mixed signal structured array.
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申请公布号 |
US2009061567(A1) |
申请公布日期 |
2009.03.05 |
申请号 |
US20080268919 |
申请日期 |
2008.11.11 |
申请人 |
TRIAD SEMICONDUCTOR, INC.;VIASIC, INC. |
发明人 |
KEMERLING JAMES C.;IHME DAVID;COX WILLIAM D. |
分类号 |
H01L21/82;H01L27/118;H03K19/177 |
主分类号 |
H01L21/82 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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