发明名称 SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device wherein a work function of a metal electrode provided on an insulating film made of a material having a higher dielectric ratio than SiO<SB>2</SB>has a desired value. SOLUTION: The semiconductor device includes: a semiconductor substrate 34; a tunnel insulating layer 36 formed on the semiconductor substrate; a floating gate electrode 37 provided on the tunnel insulating layer; an inter-electrode insulating film 38 including a first insulating layer 38a formed on the floating gate electrode and made of a material having a high-dielectric ratio and a second insulating layer 38b formed on the first insulating layer and containing silicon, oxygen, and nitrogen or containing silicon and nitrogen; a control gate electrode 40 formed on the inter-electrode insulating film; an interface layer 44 formed in an interface between the second insulating layer and the control gate electrode and containing a 13-group element; and a source-drain region 35 formed in the semiconductor substrate on both sides of the control gate electrode. As for the number of bonding states of the 13-group elements in the interface layer, the number of metal bonding states is larger than the total number of oxide, nitride, or oxide and nitride bonding states. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009060125(A) 申请公布日期 2009.03.19
申请号 JP20080273100 申请日期 2008.10.23
申请人 TOSHIBA CORP 发明人 KOYAMA MASATO;TSUCHIYA YOSHINORI
分类号 H01L21/8247;H01L21/28;H01L21/8238;H01L27/092;H01L27/115;H01L29/423;H01L29/49;H01L29/78;H01L29/788;H01L29/792 主分类号 H01L21/8247
代理机构 代理人
主权项
地址