| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for a spacer base of a chip carrier, which has heat resistance, ensures dimensional stability by controlling a linear expansion coefficient corresponding to the linear expansion coefficient of the chip carrier, is thin but ensures rigidity. SOLUTION: A spacer is interposed between the chip carriers so that each of chips is maintained at a noncontact state under a state with the chip carriers stacked, which is formed on a spacing projection part made of a resin that is fixed to the film of a base and the surface thereof and arranged. The film is a film for the spacer base of the chip carrier, which is made of a thermoplastic resin, that a thermoplastic resin composed of a mixture of an amorphous polyetherimide resin and a crystalline polyarylketone resin is added with a scale inorganic filler. COPYRIGHT: (C)2009,JPO&INPIT
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