NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF

摘要

Disclosed are: a polyimide precursor solution which can be cured at a low temperature (200°C or lower) and has excellent long-term storage stability; a photosensitive resin composition which is produced by using the solution and can be used suitably as an insulating material in electric/electronic applications; a photosensitive resin film; a thermosetting resin composition; a polyimide insulating film; and a printed circuit board equipped with an insulating film.  A polyimide precursor composition solution comprising a polyimide precursor which is at least partially imidized and has a urethane bond is used.