发明名称 SOCKET FOR ELECTRIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To prevent breakdown of a contact pin, when a cover member is closed without housing an IC package in an IC socket.SOLUTION: When cover members 30a, 30b are closed while housing an IC package 2 on a floating plate 40, the IC package 2 and floating plate 40 descend by the pressing force of the cover members 30a, 30b, and whereby the terminal 4 of the IC package 2 touches the tip of the first contact member 65 of a contact pin 60. Meanwhile, when the cover members 30a, 30b are closed without housing an IC package 2 on a floating plate 40, the package body 3 of the IC package 2 abuts against a movable spacer 29 and a movable plate 26 descends. Consequently, the step 66 of a first plunger 61 pushes down the step 26b of the movable plate 26, and whereby the first plunger 61 is pushed down, thus maintaining a state where the first plunger 61 is housed in the through hole 40a of the floating plate 40.SELECTED DRAWING: Figure 4
申请公布号 JP2016115405(A) 申请公布日期 2016.06.23
申请号 JP20140250548 申请日期 2014.12.11
申请人 ENPLAS CORP 发明人 KAMIYAMA TAKEO
分类号 H01R33/76 主分类号 H01R33/76
代理机构 代理人
主权项
地址