发明名称 |
ANTENNA MODULE PACKAGE AND MANUFACTURING METHOD THEREFOR |
摘要 |
The present invention provides an antenna module package and a manufacturing method therefor, the antenna module package comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and an element which is coupled to the chip antenna and can perform an illumination function, in addition to the chip antenna's function, or comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and a sensor which is coupled to the chip antenna and recognizes a surrounding situation or is utilized to recognize the same, in addition to the chip antenna's function, or comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and a camera module which is coupled to the chip antenna and can photograph an object, in addition to the chip antenna's function. |
申请公布号 |
WO2016186307(A1) |
申请公布日期 |
2016.11.24 |
申请号 |
WO2016KR02905 |
申请日期 |
2016.03.23 |
申请人 |
ITM SEMICONDUCTOR CO.,LTD. |
发明人 |
NA, Hyuk Hwi;HWANG, Ho Seok;KIM, Young Seok;PARK, Seong Beom;AHN, Sang Hoon;KIM, Sun Ho |
分类号 |
H01Q7/00;H01Q1/22;H05B37/02;H05K1/18 |
主分类号 |
H01Q7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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