发明名称 ANTENNA MODULE PACKAGE AND MANUFACTURING METHOD THEREFOR
摘要 The present invention provides an antenna module package and a manufacturing method therefor, the antenna module package comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and an element which is coupled to the chip antenna and can perform an illumination function, in addition to the chip antenna's function, or comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and a sensor which is coupled to the chip antenna and recognizes a surrounding situation or is utilized to recognize the same, in addition to the chip antenna's function, or comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and a camera module which is coupled to the chip antenna and can photograph an object, in addition to the chip antenna's function.
申请公布号 WO2016186307(A1) 申请公布日期 2016.11.24
申请号 WO2016KR02905 申请日期 2016.03.23
申请人 ITM SEMICONDUCTOR CO.,LTD. 发明人 NA, Hyuk Hwi;HWANG, Ho Seok;KIM, Young Seok;PARK, Seong Beom;AHN, Sang Hoon;KIM, Sun Ho
分类号 H01Q7/00;H01Q1/22;H05B37/02;H05K1/18 主分类号 H01Q7/00
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