| 摘要 |
PROBLEM TO BE SOLVED: To provide a work division device and a work division method for preventing the degradation of a chip due to slacking of a dicing tape.SOLUTION: A work division device having division means for dividing a work W attached to a dicing tape S via a die attach film D into individual chips by expanding the dicing tape S includes: a freezing chuck table 10(cooling means) for locally cooling the die attach film D by coming into contact with the die attach film D via the dicing tape S; and an optical heating device 22 (heating means) arranged in the same unit as the freezing chuck table 10 for heating the dicing tape S. |
