摘要 |
A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness equal to or less than the first thickness and has a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects more than the thickness non-uniformity of the polishing layer under an applied pressure of 1.5 psi or less.
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申请人 |
APPLIED MATERIALS, INC.;DUBOUST, ALAIN;CHANG, SHOU-SUNG;LU, WEI;NEO, SIEW;WANG, YAN;MANENS, ANTOINE;MOON, YONGSIK |
发明人 |
DUBOUST, ALAIN;CHANG, SHOU-SUNG;LU, WEI;NEO, SIEW;WANG, YAN;MANENS, ANTOINE;MOON, YONGSIK |