发明名称 Deposition of nano-crystal silicon using a single wafer chamber
摘要 Numerous embodiments of a method for depositing a layer of nano-crystal silicon on a substrate. In one embodiment of the present invention, a substrate is placed in a single wafer chamber and heated to a temperature between about 300° C. to about 490° C. A silicon source is also fed into the single wafer chamber.
申请公布号 US2007287271(A1) 申请公布日期 2007.12.13
申请号 US20070893301 申请日期 2007.08.13
申请人 PANAYIL SHEEBA J;LI MING;WANG SHULIN;PICKERING JONATHAN C 发明人 PANAYIL SHEEBA J.;LI MING;WANG SHULIN;PICKERING JONATHAN C.
分类号 H01L21/20;B05C5/00 主分类号 H01L21/20
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