发明名称 RF-ID TAG LABEL
摘要 <P>PROBLEM TO BE SOLVED: To provide an RF-ID tag label having full-scale printing aptitude by a flash fixing laser beam printer or the like. <P>SOLUTION: The RF-ID tag label is obtained by applying a heat fusion type adhesive resin to the back of a label base material, forming RF-ID tag IC chip packaging part inserting recessed parts by the use of a molding board, and while inserting RF-ID tag IC chip packaging parts of an RF-ID tag IC chip packaging inlet into the RF-ID tag IC chip packaging part inserting recessed parts, passing the RF-ID tag IC chip packaging parts through low pressure heat rolls, sticking the heat fusion type adhesive resin to the RF-ID tag IC chip packaging inlet, applying an adhesive material to the back of the RF-ID tag IC chip packaging inlet, and then sticking the RF-ID tag IC chip packaging inlet to release paper. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008210240(A) 申请公布日期 2008.09.11
申请号 JP20070047434 申请日期 2007.02.27
申请人 DAINIPPON PRINTING CO LTD 发明人 OGATA TETSUJI;ONO TETSUO
分类号 G06K19/077;B42D15/10;G06K19/07 主分类号 G06K19/077
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