发明名称 Laser array chip, laser module, manufacturing method for manufacturing laser module, manufacturing method for manufacturing laser light source, laser light source, illumination device, monitor, and projector
摘要 A laser array chip includes: a plurality of emission sections emitting laser lights; and a weak section formed in a portion in the thickness direction of at least a portion of the areas between the emission sections, whose strength is weaker than the strength of areas in which the emission sections are formed.
申请公布号 US2008232419(A1) 申请公布日期 2008.09.25
申请号 US20080076498 申请日期 2008.03.19
申请人 SEIKO EPSON CORPORATION 发明人 EGAWA AKIRA;TAKAGI KUNIHIKO
分类号 H01S5/10;H01L21/02;H01L33/00 主分类号 H01S5/10
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