发明名称 ASYMMETRIC HIGH-K DIELECTRIC FOR REDUCING GATE INDUCED DRAIN LEAKAGE
摘要 An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
申请公布号 US2016204209(A1) 申请公布日期 2016.07.14
申请号 US201615076021 申请日期 2016.03.21
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHOU Anthony I.;KUMAR Arvind;LIN Chung-Hsun;NARASIMHA Shreesh;ORTOLLAND Claude;SHAW Jonathan T.
分类号 H01L29/40;H01L21/324;H01L29/66;H01L21/3115 主分类号 H01L29/40
代理机构 代理人
主权项 1. A method comprising: performing an implant process on a high-k dielectric sidewall of a gate structure; performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region; and performing a damaging process on a sacrificial sidewall on a source side of the gate structure.
地址 Armonk NY US