PACKAGED SEMICONDUCTOR DEVICE HAVING LEADFRAME FEATURES PREVENTING DELAMINATION

摘要

A semiconductor device has a leadframe with a first (401a) and a parallel second surface, and an assembly pad (410) bordered by two opposing sides, which include a plurality of through-holes (420) from the first to the second pad surface. Another pad side includes one or more elongated windows (421) between the pad surfaces. The second pad surface includes a plurality of grooves. The leadframe further has a plurality of leads (430) with opposite elongated sides castellated by indents (431). Layers (440) of bondable metals are restricted to localized areas surrounding bond spots. A semiconductor chip (450) is attached to the pad and wire-bonded (460) to the bond spots. A package (470) encapsulates the chip, wires, pad, and lead portions, and secures the leadframe into the package by filling the through-holes, windows, grooves, and indents.

主权项

1. A leadframe comprising:
a pad for assembling semiconductor chips, the pad bordered by two opposing sides including a plurality of through-holes from the first to the second pad surface, and by another side including one or more elongated windows between the pad surfaces, the pad surface opposite the assembly surface sprinkled by a plurality of grooves; and a plurality of leads having opposite elongated sides castellated by indents.