| 发明名称 |
MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANAGEMENT METHOD OF MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE |
| 摘要 |
According to one embodiment, a management method of a manufacturing apparatus of a semiconductor device, the method includes measuring a weight of a pre-exposure substrate including a semiconductor substrate and a resist film provided on the semiconductor substrate, performing an exposure process for the resist film, measuring a weight of a post-exposure substrate including the semiconductor substrate and the resist film after the exposure process is performed, and acquiring a weight difference between the weight of the pre-exposure substrate and the weight of the post-exposure substrate. |
| 申请公布号 |
US2016204040(A1) |
申请公布日期 |
2016.07.14 |
| 申请号 |
US201514835854 |
申请日期 |
2015.08.26 |
| 申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
SHIOBARA Eishi |
| 分类号 |
H01L21/66;G03F7/20;H05G2/00;H01L21/67;H01L21/027 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A management method of a manufacturing apparatus of a semiconductor device, the method comprising:
measuring a weight of a pre-exposure substrate including a semiconductor substrate and a resist film provided on the semiconductor substrate; performing an exposure process for the resist film; measuring a weight of a post-exposure substrate including the semiconductor substrate and the resist film after the exposure process is performed; and acquiring a weight difference between the weight of the pre-exposure substrate and the weight of the post-exposure substrate. |
| 地址 |
Minato-ku JP |
