COMPOSITION FOR ENCAPSULANT AND ENCAPSULANT AND ELECTRONIC DEVICE

摘要

The present invention provides a composition for an encapsulant, an encapsulant obtained by curing the composition, and an electronic device including the encapsulant. The composition for an encapsulant has a viscosity of about 4,000-9,500 mPa·s when measured using a Brookfield (DV-II+pro) spindle No. 52 at a torque of about 90% under atmospheric pressure at about 23°C, maintains a precipitation degree of a phosphor within about 18% when including a phosphor and allowed to be left at about 23° C for about 2 hours or longer, and includes at least one first siloxane compound having a silicon-bonded hydrogen (Si-;H) and at least one second siloxane compound having a silicon-bonded alkenyl group (Si-Vi).