SEMICONDUCTOR DIE ATTACHMENT FOR HIGH VACUUM TUBES

摘要

An ultra-high vacuum tube as an imaging device comprises a semiconductor die (10) including multiple bonding pads (9) arrayed symmetrically on a surface of the die, the bonding pads (9) being electrically isolated; a housing (17) of a different material than the semiconductor die, said housing including matching bonding pads (25) on an inner surface of the housing; a brazing material (29) having a melting point of less than 200°C positioned between said bonding pads (9) of said die (10) and said matching bonding pads (25) of said housing (17) to connect said die (10) to said housing (17) in alignment; and an ultra high vacuum enclosed in said housing (17) formed by a baking process at a temperature above 200°C at which the brazing material (29) re-melts.