发明名称 |
METHOD FOR MANUFACTURING PLATED MATERIAL AND PLATED MATERIAL |
摘要 |
Provided are: a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, and wherein a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment. |
申请公布号 |
US2016348260(A1) |
申请公布日期 |
2016.12.01 |
申请号 |
US201415028051 |
申请日期 |
2014.04.16 |
申请人 |
ORIENTAL ELECTRO PLATING CORPORATION |
发明人 |
TAKAHASHI Hiroyoshi |
分类号 |
C25D5/12;C25F1/00;C25F5/00;H01R13/03;C25D3/48;C25D3/50;C25D3/40;C25D3/12;C25D5/50;C25D3/46 |
主分类号 |
C25D5/12 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for manufacturing a plated material, comprising:
a first step to peel at least a portion of a reflow tin-plated layer from a metal substrate that comprises the reflow tin-plated layer at least partially, and that comprises a reactive layer on an interface between the reflow tin-plated layer and the metal substrate; a second step to apply nickel plate processing to at least a portion in a region where the reflow tin-plated layer has been peeled; a third step to apply silver strike plate processing to at least a portion of the nickel-plated layer formed by the nickel plate processing; and a fourth step to apply silver plate processing to at least a portion of the region where silver strike plate processing has been applied. |
地址 |
Kobe-shi, Hyogo JP |