| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To further reduce packaging height in a WLCSP semiconductor device. <P>SOLUTION: In the WLCSP semiconductor device, an electrode post 28 embedded in a mold resin film 29 is made to form a spherical recess 28a in its end face, and a sold 30 is formed to embed the inside of the recess 28a. The semiconductor device is packaged in a state where a land enters the recess 28a, and in a state where the mold resin film 29 is brought into contact with a packaged substrate on the same. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
