ELECTRONIC PARTS PACKAGES AND METHOD FOR FORMING A CAVITY THEREOF

摘要

Disclosed is an electronic part package for improving reflectability of light emitted from a light emitting device, and a method of forming a cavity of the electronic part package to improve the reflectability of light so that the cavity of a ceramic substrate is easily formed to have the desired shape. The cavity of the ceramic substrate has a shape tapered inward so that an inclined side is roundly concave and convex. The method includes shifting a tool that includes a cutting part having a cutting blade formed on an external surface thereof toward the ceramic substrate by a predetermined distance while the tool rotates along with a rotational processing part of a ceramic processing device and returning the tool to an original position of the tool to form a cavity having the inclined side in the ceramic substrate.