| 摘要 |
A multi-chip package is provided to remove a long wire bonding process by arranging directly small-sized semiconductor chips on a substrate and attaching large-sized semiconductor chips through a bump onto the substrate. A ball land(205) is formed at one side of a substrate(200). A first semiconductor chip(210) is mounted on the other side of the substrate and is electrically connected with the substrate. A second semiconductor chip(220) is arranged at an upper end of the first semiconductor chip. The size of the second semiconductor chip is larger than the side of the first semiconductor chip. A bump is formed at an edge of the second semiconductor chip. The second semiconductor chip is attached through the bump onto the substrate. A solder ball(270) is attached on the ball land of the substrate. |
