METHOD OF ASSEMBLING TWO SUBSTRATES BY MEANS OF BONDING AND METHOD OF DISASSEMBLING SAID BONDED ASSEMBLY BY MEANS OF MIGRATION

摘要

The invention relates to a method of assembling a first substrate (10) and a second substrate (12) by means of bonding with at least one joint (14). The invention is characterised in that it comprises the following successive steps consisting in: positioning at least one polymer joint (14) between the first (10) and second (12) substrates, said at least one joint comprising at least one migrating agent which can migrate to at least one of the interfaces of the at least one joint in order to generate a layer with low cohesion; pressing the two substrates (10, 12) against one another; and polymerising the at least one joint (14) in order to obtain a bonded assembly comprising said two substrates (10, 12).