BONDING METHOD, SUBSTRATE PROCESSING METHOD, AND BONDING SYSTEM

摘要

PROBLEM TO BE SOLVED: To prevent deterioration in productivity.SOLUTION: A bonding method according to an embodiment includes an application step, a bevel cleaning step, an inspection step, and a bonding step. The application step applies and spreads an adhesive on a first substrate. The bevel cleaning step cleans a bevel part of the first substrate after the application step. The inspection step determines whether the adhesive exists in the bevel part by inspecting the surface state of the bevel part after the bevel cleaning step. The bonding step bonds the first substrate and a second substrate via the adhesive after the inspection step.