| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for copper film formation in a solution state not including a solid phase of fine particles etc., such that a copper film which has sufficient electric conductivity and is high in adhesion to a base body can be obtained with low energy by applying the composition for copper film formation over the base body and processing it by a flash lamp method using a xenon lamp.SOLUTION: There is provided a composition for copper film formation that contains at least one kind of diol compound selected from the group of copper formate or its hydrate, a compound represented by general formula (1) and a compound represented by general formula (1'), a specific dye compound, and an organic solvent dissolving components thereof, and contains the diol compound within a range of 0.1 to 6.0 mol/kg when the total of the content of the copper formate or its hydrate and the content of copper acetate or its hydrate is 1 mol/kg. |
