WHITE HEAT-CURABLE EPOXY RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT CASE MADE OF THE WHITE HEAT-CURABLE EPOXY RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE COMPRISED OF THE OPTICAL SEMICONDUCTOR ELEMENT

摘要

Provided are a white heat-curable epoxy resin composition having a high strength, high toughness and superior heat resistance; and a semiconductor device whose light receiving and other semiconductor elements are encapsulated by a cured product of such composition. The composition includes:
(A) a prepolymer obtained by heating, melting and mixing components (A-1) triazine derivative epoxy resin, (A-2) acid anhydride and (A-3) acrylic block copolymer so as to react them at an epoxy group equivalent in the component (A-1)/acid anhydride group equivalent of the component (A-2) ratio of 0.6 to 2.0;(B) a white pigment including at least a titanium oxide;(C) an inorganic filler;(D) a curing accelerator; and(E) an antioxidant.

主权项

1. A white heat-curable epoxy resin composition comprising:
(A) a prepolymer obtained by a reaction of components (A-1), (A-2) and (A-3) at an epoxy group equivalent in the component (A-1)/acid anhydride group equivalent of the component (A-2) ratio of 0.6 to 2.0, the component (A-1) being a triazine derivative epoxy resin, the component (A-2) being an acid anhydride, and the component (A-3) being an acrylic block copolymer and added in an amount of 2 to 20 parts by mass with respect to 100 parts by mass of a total sum of the components (A-1) and (A-2); (B) a white pigment including at least a titanium oxide, the white pigment being in an amount of 3 to 350 parts by mass with respect to the total sum of the components (A-1) and (A-2); (C) an inorganic filler being in an amount of 80 to 600 parts by mass with respect to 100 parts by mass of the total sum of the components (A-1) and (A-2); (D) a curing accelerator being in an amount of 0.05 to 5 parts by mass with respect to the total sum of the components (A-1) and (A-2); and (E) an antioxidant being in an amount of 0.01 to 10 parts by mass with respect to the total sum of the components (A-1) and (A-2).