Passive device embedded in substrate and substrate with passive device embedded therein

摘要

The present invention relates to a passive device embedded in a substrate, which includes a laminate formed by alternately laminating a plurality of internal electrodes and dielectric layers; a first external electrode covering one side surface of the laminate and having a first upper cover region, which covers a part of an upper portion of the laminate, and a first lower cover region, which covers a part of a lower portion of the laminate and is smaller than the first upper cover region; and a second external electrode covering the other side surface of the laminate and having a second lower cover region, which covers a part of the lower portion of the laminate, and a second upper cover region, which covers a part of the upper portion of the laminate and is smaller than the second lower cover region, and the substrate.

主权项

1. A substrate with a passive device embedded therein, comprising:
a core layer having a cavity; a passive device comprising
a laminate formed by alternately laminating a plurality of internal electrodes and dielectric layers,a first external electrode having a first upper cover region, which covers a part of an upper portion of the laminate, and a first lower cover region, which covers a part of a lower portion of the laminate and has a smaller area than the first upper cover region, anda second external electrode having a second lower cover region, which covers a part of the lower portion of the laminate, and a second upper cover region, which covers a part of the upper portion of the laminate and has a smaller area than the second upper cover region, wherein the first upper cover region is larger than the second upper cover region, and the second lower upper region has a larger area than the first lower cover region, and embedded in the cavity; insulating layers laminated on and under the core layer; circuit patterns formed on the insulating layers; and vias respectively mounted on the first upper cover region and the second lower cover region of the passive device through the insulating layers to electrically connect the first and second external electrodes to the circuit patterns, wherein only one via is on the first upper cover region of the passive device and only one via is on the second lower cover region of the passive device.