| 发明名称 | Electronic component package | ||
| 摘要 | Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic component package, the warpage phenomenon may be decreased as compared with the related art. | ||
| 申请公布号 | US9155192(B2) | 申请公布日期 | 2015.10.06 |
| 申请号 | US201314051019 | 申请日期 | 2013.10.10 |
| 申请人 | Samsung Electro-Mechanics Co., Ltd. | 发明人 | Lee Kyung Ho;Woo Seung Wan;Kim Po Chul;Hwang Young Nam;Ham Suk Jin |
| 分类号 | B32B3/00;H05K1/02;H05K3/28;H01L23/00;H01L23/06;H01L23/16;H05K3/34;H01L23/31 | 主分类号 | B32B3/00 |
| 代理机构 | NSIP Law | 代理人 | NSIP Law |
| 主权项 | 1. An electronic component package comprising: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon, the electronic component package having a warpage value of 0 or less, and the additional layer being made of a material having a coefficient of thermal expansion of 15×10−6/° C. or more. | ||
| 地址 | Suwon-si KR | ||