| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in low thermal expansion, high temperature adhesiveness and film formation, and a photosensitive film, a photosensitive sheet, a resin pattern, a semiconductor wafer with a resin layer, and a semiconductor device each of which is prepared with the photosensitive resin composition.SOLUTION: A photosensitive resin composition comprises (A) resin having a phenolic hydroxyl group and/or a carboxyl group, (B) a compound having an ethylenically unsaturated group, (C) thermosetting resin, (D) photoinitiator, and (E) silica having an organic group, where silica having an organic group has an average particle diameter of 30-400 nm, and the content of the silica having an organic group is 25-60 mass% based on the total mass of the photosensitive resin composition,.SELECTED DRAWING: Figure 3 |
