发明名称 |
LOW POWER, HIGH SPEED MULTI-CHANNEL CHIP-TO-CHIP INTERFACE USING DIELECTRIC WAVEGUIDE |
摘要 |
An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device. |
申请公布号 |
EP2939307(A4) |
申请公布日期 |
2016.11.02 |
申请号 |
EP20130867509 |
申请日期 |
2013.09.12 |
申请人 |
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
BAE, HYEON MIN;SONG, HA II;JIN, HUXIAN |
分类号 |
H01P3/16;H01P3/12;H01P5/107 |
主分类号 |
H01P3/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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