| 摘要 |
Methods and apparatus for inspecting a substrate for defects and locating such defects in three dimensions include: orienting the substrate such that the substrate has a width dimension in an X-axis, a height dimension in a Y-axis, and a thickness dimension in a Z-axis; directing a first light beam from an angle of +A degrees from a Z-axis of symmetry; directing second light beam from an angle -A degrees from the Z-axis of symmetry; detecting the first and second light beams that have passed through, and have been affected by any defects a first and/or second opposing major surface of the substrate; and computing X, Y, and Z positions of the defects with sufficient precision to ascertain on which of the first and second opposing major surfaces of the substrate each of the defects are disposed. |
