| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring testing method and wiring testing device for testing the electric quality of wiring in printed wiring boards and various semiconductor package substrates (BGA, CSP, TAB, etc.) which are superior in positioning accuracy. SOLUTION: The wiring test device 100 is constituted of a test probe 10, a recognition means 20 for reading a positioning mark and test point, a moving and positioning means 30 for moving/positioning the test probe, a calibration jig 40 having reference marks 41X and 41Y, a judging means 50 for deciding the electrical quality of the wiring, and a control means 60 for controlling testing device as a whole. Before initiating a wiring test, moving dimension accuracy of the test probe is calibrated by using the calibration jig having a reference mark, and then wiring test is initiated. COPYRIGHT: (C)2005,JPO&NCIPI
|
