<p>The traditional device interface board is replaced by a number of smaller strips containing one or more electrical components for interfacing the device under test and the test head. The device interface modules may mount to a stiffening member having a back bone and multiple ribs running through the stiffening member. The device interface strips can create a lattice-like structure for the interface circuitry. Individual circuits may be disposed on the interface strips to perform functionality relating to the device under test and/or the test head.</p>
申请公布号
WO2007050865(A1)
申请公布日期
2007.05.03
申请号
WO2006US41965
申请日期
2006.10.27
申请人
TERADYNE, INC.;PARRISH, FRANK, B.;CASTELLANO, DEREK, M.