发明名称 LEAD-FREE SOLDER ALLOY
摘要 <p>An alloy suitable for use in tinning or the manufacture of heat exchangers, the alloy comprising: from 2 - 6 wt.% copper, from 0.08 - 1.5 wt.% bismuth, from 0 - 1.5 wt.% silver, from 0 - 0.02 wt.% phosphorus, from 0 - 0.02 wt.% germanium, from 0 - 0.15 wt% of indium, from 0 - 0.3 wt% of silicon, from 0 - 0.2 wt% of zirconium, one or both of from 0.02 - 0.2 wt.% nickel and/or from 0.01 - 0.2 wt.% cobalt, and the balance tin, together with unavoidable impurities.</p>
申请公布号 WO2007049025(A1) 申请公布日期 2007.05.03
申请号 WO2006GB03948 申请日期 2006.10.23
申请人 ALPHA FRY LIMITED;CAMPBELL, GERARD;INGHAM, ANTHONY 发明人 CAMPBELL, GERARD;INGHAM, ANTHONY
分类号 B23K35/26;C22C13/00 主分类号 B23K35/26
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