| 发明名称 |
METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA |
| 摘要 |
A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.
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| 申请公布号 |
US2009057910(A1) |
申请公布日期 |
2009.03.05 |
| 申请号 |
US20070847985 |
申请日期 |
2007.08.30 |
| 申请人 |
INTEL CORPORATION |
发明人 |
MYERS TODD B.;WATTS NICHOLAS R.;PALMER ERIC C.;LIM JUI MIN |
| 分类号 |
H01L29/00;H01G4/005;H01L21/48;H01L23/48;H01L23/498;H01L23/52;H01L23/66;H05K1/11;H05K1/16;H05K3/40 |
主分类号 |
H01L29/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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