摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant resin molded article having more excellent heat resistance and hardly causing deformation, warpage etc., by heating, while having excellent properties of conventional syndiotactic polystyrene resin molded article, and to provide an electronic component comprising the heat-resistant resin molded article. SOLUTION: The heat-resistant resin molded article is a molded article obtained by molding a resin composition containing a styrene-based polymer having a syndiotactic structure and crosslinking the styrene-based polymer and has a storage elastic modulus at 350°C of≥1 MPa. The electronic component comprises the heat-resistant resin molded article. COPYRIGHT: (C)2009,JPO&INPIT
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