发明名称 HEAT-RESISTANT RESIN MOLDED ARTICLE AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a heat-resistant resin molded article having more excellent heat resistance and hardly causing deformation, warpage etc., by heating, while having excellent properties of conventional syndiotactic polystyrene resin molded article, and to provide an electronic component comprising the heat-resistant resin molded article. SOLUTION: The heat-resistant resin molded article is a molded article obtained by molding a resin composition containing a styrene-based polymer having a syndiotactic structure and crosslinking the styrene-based polymer and has a storage elastic modulus at 350°C of≥1 MPa. The electronic component comprises the heat-resistant resin molded article. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009057424(A) 申请公布日期 2009.03.19
申请号 JP20070224173 申请日期 2007.08.30
申请人 SUMITOMO ELECTRIC FINE POLYMER INC 发明人 NAKABAYASHI MAKOTO
分类号 C08J7/00;C08K3/00;C08L25/04 主分类号 C08J7/00
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