发明名称 CONNECTION BODY, MANUFACTURING METHOD OF THE SAME, AND INSPECTION METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To improve the visibility of indentations and quickly and properly conduct an inspection conducted after connection in a connection process using an anisotropic conductive film.SOLUTION: A connection body includes: a transparent substrate; and an electronic component connected with the transparent substrate through an anisotropic conductive adhesive. Multiple indentations caused by conductive particles contained in the anisotropic conductive adhesive are arranged in an in-plane direction at a terminal of the transparent substrate.
申请公布号 JP2015179831(A) 申请公布日期 2015.10.08
申请号 JP20150034548 申请日期 2015.02.24
申请人 DEXERIALS CORP 发明人 TSUKAO SATOSHI
分类号 H01L21/60;H05K3/32;H05K3/34 主分类号 H01L21/60
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